Apple iPhone SE 2 3D render Image: Tiger Mobiles
The Apple iPhone SE 2 is expected to release at the WWDC around June and there has been considerable interest surrounding the second generation of Apple's budget iPhone. There have been no official updates about the device from Apple's side, but rumour mills have been working overtime ever since 11 iPhone model numbers were registered with the Eurasian Economic Commission (EEC). And now we have leaked AutoCAD (CAD) 3D renders of the upcoming device.
The CAD render was first outed by prolific leaker Steve H, who goes by the @OnLeaks handle on Twitter. Tiger Mobiles have since then picked up on it and published more renders.
Do note, the veracity or the source of the leaked renders couldn't be verified by Steve, so take these with a bit of salt. The leaked images are, however, in line with earlier reports claiming that the SE 2 will lose the headphone jack.
Now that u aware I can't confirm if this one is partially or completely accurate or even exists but despite of that decided to share it for discussion purposes only, this is what #iPhoneSE2 might look like (360° video + size). On behalf of @tigermobiles -> https://t.co/lEJrA4Esd0 pic.twitter.com/6Up5zG8vvP— Steve H. (@OnLeaks) April 30, 2018
Here's the full 360-degree video from Tiger Mobiles.
As per the leak, the SE 2 seems to retain the classic iPhone SE look. According to earlier reports, the SE 2 may come with a 4.2-inch bezel-less display with a top notch. The device is expected to be powered by Apple's A10 Fusion SoC chipset — the same chip found in the iPhone 7 and iPhone 7 Plus — coupled with 2GB of RAM. The device will come in 32GB and 128GB storage variants.
On the camera front, rumours claim that the SE 2 will have a 12MP rear camera and a 5MP selfie shooter. The SE2 will also retain the fingerprint sensor on the home button and run iOS 12. But the SE 2 won't be coming with 3D mapping technology or even wireless charging support, but there have been reports of some sort of a FaceID feature being included in the device.